Rigid Circuit Board
Fiberglass Epoxy Resin + Polyimide Resin
Medical Instruments
V2
Fexible
Delay Pressure Foil
Metal Composite Materials
Retangular, Round, Slots, Cutouts, Complex, Irreg
OSP, Immersion Gold, Immersion Tin, Immersion AG
Turnkey Assembly PCB Service
Repair/Rework Services Mechanical Assembly Box Bui
Mechanical Hole: 0.15mm, Laser Hole: 0.1mm
Rout/ V-Cut/ Bridge/ Stamp Hole
ISO9001, ISO14000, Ts16949.UL.RoHS
-40c~125c
Green;Red;Yellow;Black;White
HASL, Gold Finger, OSP, Enig, Peelable Mask
600*800mm
Inner Vacuum Packing Outer Carton Box
FR 4, 0.8mm, 1 Layer, 1OZ Copper Thickness