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3 Layers Rigid-Flexible PCB Board

Production Capacity:

10000 PCS/Days

Model NO.:

Fl5263

Brand:

Fastline

Insulation Materials:

Epoxy Resin

Base Material:

Polyimide & Fr4

Processing Technology:

Electrolytic Foil

Flame Retardant Properties:

V2

Conductive Adhesive:

Anisotropic Conductive Adhesive

Application:

Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace

Combination Mode:

Adhesive Flexible Plate

Material:

Polyimide

Structure:

Multilayer FPC

Layer:

2

Solder Mask:

Green + Yellow Cover Film

Board Thickess:

1.6mm Rigid and 0.1mm Flex

Copper Thickness:

1oz

Silk Screen:

White

Test:

100%

Small Order:

Accepter

Board Material:

Fr4+ Polymide

PCB Type:

Rigd-Flex PCB

Product Type:

Customized

Trademark:

Fastline

Transport Package:

Vacuum Packing

Specification:

Rohs, UL

Origin:

Shenzhen

HS Code:

8534009000

Fastline Circuits Co., Limited

Member Since: 2013

Business Type: Manufacturer/Factory

Shenzhen, Guangdong, China

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