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Back Grinding Of Wafers

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Precision Diamond Back Grinding Wheel for Silicon Wafer Cutting

Precision Diamond Back Grinding Wheel for Silicon Wafer Cutting

US $ 2,200-2,300 / Piece FOB
2 Pieces (MOQ)
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Main Products: Emery Wheel, Honing, Grinding Wheel
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Zhengzhou Yaxin Superhard Materials Co., Ltd.

Manufacturer/Factory

Henan, China Since 2025
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6A2t Hybrind Bond Wafer Back Grinding Wheel

6A2t Hybrind Bond Wafer Back Grinding Wheel

US $ 500-2,000 / Piece FOB
1 Piece (MOQ)
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Technics : Sinter
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Henan E-Grind Abrasives Co., Ltd.

Henan, China Since 2017
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6A2t Diamond Grinding Wheel for Wafer Back Thinning

6A2t Diamond Grinding Wheel for Wafer Back Thinning

US $ 500-2,000 / Piece FOB
1 Piece (MOQ)
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Main Products: Diamond/CBN Grinding Wheels, PDC PCD, Synthetic Diamond Powder, CBN, Sharpening Stone, Conventional Abrasives and Tools
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Henan E-Grind Abrasives Co., Ltd.

Henan, China Since 2017
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High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device

High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device

1 Piece (MOQ)
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Application : Automotive Industry
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Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China Since 2023
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Diamond and CBN Grinding Wheels. Superabrasives Grinding Wheels

Diamond and CBN Grinding Wheels. Superabrasives Grinding Wheels

US $ 30-100 / Piece FOB
1 Piece (MOQ)
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Main Products: Emery Wheel, Honing, Grinding Wheel
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Zhengzhou Yaxin Superhard Materials Co., Ltd.

Manufacturer/Factory

Henan, China Since 2025
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High Precision Quantitative Grinding Machine Metallographic Grinding Machine Quantitative Grinder

High Precision Quantitative Grinding Machine Metallographic Grinding Machine Quantitative Grinder

US $ 1,000-4,000 / Piece FOB
1 Piece (MOQ)
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Variable Speed : With Variable Speed
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Trojan (Suzhou) Material Technology Co., Ltd.

Manufacturer/Factory & Trading Company

Jiangsu, China Since 2017
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8 Inches Fully Automatic Wafer Grinder Dfg8560

8 Inches Fully Automatic Wafer Grinder Dfg8560

US $ 180,000 / Piece FOB
1 Piece (MOQ)
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Main Products: Aluminum Foil, Heat Shrinkable Tube, Aluminum Case, Etched Aluminum Foil, Masking Tape, Pet Film, Rubber Seal, Con Paper for Electrolytic Capacitor, Tab Anode Foil, Semi-Conductor Device
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Ninghai County Chalu Jinbaili Daily Necessities Store

Zhejiang, China Since 2016
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4 Inches Semi-Automatic Wafer Grinder Dag810

4 Inches Semi-Automatic Wafer Grinder Dag810

US $ 180,000 / Piece FOB
1 Piece (MOQ)
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Object : Saw Blade
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Ninghai County Chalu Jinbaili Daily Necessities Store

Zhejiang, China Since 2016
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Semicon Industry Device Semiconductor Fabrication Wafer Fab Fully Automatic Wafer Back Thinning Wafer Grinder Grinding Machine

Semicon Industry Device Semiconductor Fabrication Wafer Fab Fully Automatic Wafer Back Thinning Wafer Grinder Grinding Machine

US $ 99,999-999,999 / Piece FOB
1 Piece (MOQ)
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Main Products: Wire Bonder, Soldering Machine, Vacuum Pump, Solering Robot, Battery Tester, Grinder Polisher, Dicing Saw, Die Bonder
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Guangzhou Minder-Hightech co.,Ltd

Guangdong, China Since 2017
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Durable Silicon Wafer Back Grinding Wheel in Semiconductor Applications

Durable Silicon Wafer Back Grinding Wheel in Semiconductor Applications

US $ 1,500-2,500 / Piece FOB
1 Piece (MOQ)
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Zhengzhou Hongtuo Precision Tools Co., Ltd.

Manufacturer/Factory & Trading Company

Henan, China Since 2024
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Wafer Fab Fab Feol Beol Semiconductor Device Fabrication Horizontal Back Grinder Mdym-230wh Mdym-300wh

Wafer Fab Fab Feol Beol Semiconductor Device Fabrication Horizontal Back Grinder Mdym-230wh Mdym-300wh

US $ 15,000-50,000 / Piece FOB
1 Piece (MOQ)
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Main Products: Wire Bonder, Soldering Machine, Vacuum Pump, Solering Robot, Battery Tester, Grinder Polisher, Dicing Saw, Die Bonder
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Guangzhou Minder-Hightech co.,Ltd

Guangdong, China Since 2017
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Good Performance Silicon Wafer Back Thinning Wheel Grinding Wheel

Good Performance Silicon Wafer Back Thinning Wheel Grinding Wheel

US $ 1,600-2,300 / Piece FOB
1 Piece (MOQ)
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Effect : Polishing
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Audited Supplier
Zhengzhou Hongtuo Precision Tools Co., Ltd.

Manufacturer/Factory & Trading Company

Henan, China Since 2024
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Vitrified Bond Diamond Grinding Wheel Semiconductor Thinner Grinding Wheel Silicon Wafer Back Grinding Wheels

Vitrified Bond Diamond Grinding Wheel Semiconductor Thinner Grinding Wheel Silicon Wafer Back Grinding Wheels

US $ 1,858-2,450 / Piece FOB
1 Piece (MOQ)
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Main Products: Hardware Products, Ordinary Mechanical Equipment
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Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
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Jzrs12c-24c Back Wet Grinding of Wafers Electric Angle Grinder for Granite Polisher

Jzrs12c-24c Back Wet Grinding of Wafers Electric Angle Grinder for Granite Polisher

US $ 55,700-55,900 / Piece FOB
1 Piece (MOQ)
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Application : Ceramics, Concrete Curb, Granite, Marble
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Jinzuanyun (Xiamen) Import & Export Co., Ltd.

Trading Company

Fujian, China Since 2024
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Semiconductor Device Fabrication Fab Simplified Vertical Wafer Back Thinner Mdym Series

Semiconductor Device Fabrication Fab Simplified Vertical Wafer Back Thinner Mdym Series

US $ 1-57,000 / Piece FOB
1 Piece (MOQ)
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Main Products: Wire Bonder, Soldering Machine, Vacuum Pump, Solering Robot, Battery Tester, Grinder Polisher, Dicing Saw, Die Bonder
Contact Supplier
Audited Supplier
Guangzhou Minder-Hightech co.,Ltd

Guangdong, China Since 2017
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Vitrified Bond Back Grinding Wheel Silicon Wafer Thinner Grinding Wheel for Photovoltaic Industry

Vitrified Bond Back Grinding Wheel Silicon Wafer Thinner Grinding Wheel for Photovoltaic Industry

US $ 1,875-2,867.64 / Piece FOB
10 Pieces (MOQ)
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Bonding Agent : Resin
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Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
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Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

US $ 10-12.5 / Square Meter FOB
30 Square Meters (MOQ)
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Main Products: Graphite Sheet and Die Cutting Parts Thereof, Die-Cut Components for The Electronics Industry, Auxiliary Materials for The Semiconductor Field, Industrial Materials for Coating or Components, Hardware Plastic Design and Manufacturing, LSR Processing and Assembly Parts Thereof
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Dongguan Keraf Electronic Technology Co., Ltd.

Manufacturer/Factory & Trading Company

Guangdong, China Since 2023
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Semiconductor Silicon Wafer Back Grinding Wheel for Precision Chip Processing

Semiconductor Silicon Wafer Back Grinding Wheel for Precision Chip Processing

US $ 1,500-2,500 / Piece FOB
1 Piece (MOQ)
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Zhengzhou Hongtuo Precision Tools Co., Ltd.

Manufacturer/Factory & Trading Company

Henan, China Since 2024
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Integrated Chips IC Silicon Wafer Back Grinding Discrete Devices Silicon Wafer Thinner Grinding Wheel

Integrated Chips IC Silicon Wafer Back Grinding Discrete Devices Silicon Wafer Thinner Grinding Wheel

US $ 1,858-2,450 / Piece FOB
1 Piece (MOQ)
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Main Products: Hardware Products, Ordinary Mechanical Equipment
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Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
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Customized Sapphire Epitaxial Wafer Rough Grinding Wheel Fine Grinding Metal Bond Back Grinding Wheel

Customized Sapphire Epitaxial Wafer Rough Grinding Wheel Fine Grinding Metal Bond Back Grinding Wheel

US $ 2,000-3,058 / Piece FOB
10 Pieces (MOQ)
More
Bonding Agent : Metal
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Audited Supplier
Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
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Related Videos
  • What is Precision Diamond Back Grinding Wheel for Silicon Wafer Cutting
    What is Precision Diamond Back Grinding Wheel for Silicon Wafer Cutting
    US $ 2,200-2,300 /Piece
    2 Pieces (MOQ)
    Contact Supplier
  • What is 6A2t Hybrind Bond Wafer Back Grinding Wheel
    What is 6A2t Hybrind Bond Wafer Back Grinding Wheel
    US $ 500-2,000 /Piece
    1 Piece (MOQ)
    Contact Supplier
  • What is 6A2t Diamond Grinding Wheel for Wafer Back Thinning
    What is 6A2t Diamond Grinding Wheel for Wafer Back Thinning
    US $ 500-2,000 /Piece
    1 Piece (MOQ)
    Contact Supplier
  • What is High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device
    What is High Precision Wafer Thinning Machine Grinding Equipment Manufacturers Industrial Automation Device
    Negotiable
    1 Piece (MOQ)
    Contact Supplier
Semiconductor Silicon Wafer Back Grinding Wheel Precision & Reliability

Semiconductor Silicon Wafer Back Grinding Wheel Precision & Reliability

US $ 1,500-2,500 / Piece FOB
1 Piece (MOQ)
More
Main Products: Honing Tools, Grinding Wheels
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Audited Supplier
Zhengzhou Hongtuo Precision Tools Co., Ltd.

Manufacturer/Factory & Trading Company

Henan, China Since 2024
Chat Now Send Inquiry
IC Substrate Silicon Wafers Back Grinding Wheel for Fine Grinding Silicon Wafer Back Grinding Wheels

IC Substrate Silicon Wafers Back Grinding Wheel for Fine Grinding Silicon Wafer Back Grinding Wheels

US $ 1,858-2,450 / Piece FOB
1 Piece (MOQ)
More
Manufacturing Process : Sintered
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Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
Chat Now Send Inquiry
Back Grinding Wheels for Silicon Wafers Process

Back Grinding Wheels for Silicon Wafers Process

US $ 1,500-2,500 / Piece FOB
1 Piece (MOQ)
More
Main Products: Honing Tools, Grinding Wheels
Contact Supplier
Audited Supplier
Zhengzhou Hongtuo Precision Tools Co., Ltd.

Manufacturer/Factory & Trading Company

Henan, China Since 2024
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About Back Grinding Of Wafers FAQ

  • QHow can I evaluate the quality of grinding machine suppliers in China?

    The Back Grinding Of Wafers is classified under our comprehensive Grinding Machine range.When assessing the quality of grinding machine suppliers in China, consider factors such as experience, certifications, and customer reviews. Requesting product samples and conducting on-site visits can also help verify the supplier's capabilities. Choosing a reputable supplier ensures reliable and high-quality machinery.

  • QWhat advantages does wholesale purchase of grinding machines offer?

    Discover the perfect addition to your Grinding Machine with our Back Grinding Of Wafers.Buying grinding machines wholesale provides cost savings, bulk purchase convenience, and consistent product quality. Wholesale orders often come with discounts and customization options, ensuring you receive top-notch machinery from trusted suppliers.

  • QWhat are the key components of a grinding machine?

    Our Back Grinding Of Wafers offers exceptional quality within the Grinding Machine category.A grinding machine typically consists of a grinding wheel, a workpiece holding device, and a reciprocating or rotating table. Each component plays a crucial role in achieving accurate and efficient grinding results. Partnering with a trusted manufacturer ensures you receive high-quality components.

Sapphire Wafers Silicon Wafers Diamond Grinding Wheel Gallium Nitride Wafers Thinning Back Grinding Wheel

Sapphire Wafers Silicon Wafers Diamond Grinding Wheel Gallium Nitride Wafers Thinning Back Grinding Wheel

US $ 1,875-2,867.64 / Piece FOB
10 Pieces (MOQ)
More
Shape : Cup-Shaped
Contact Supplier
Audited Supplier
Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
Chat Now Send Inquiry
Hot Selling Silicon Wafer Diamond Back Cutting Wheel Thinning Wheels

Hot Selling Silicon Wafer Diamond Back Cutting Wheel Thinning Wheels

US $ 2,100-2,200 / Piece FOB
1 Piece (MOQ)
More
Main Products: Honing Tools, Grinding Wheels
Contact Supplier
Audited Supplier
Zhengzhou Hongtuo Precision Tools Co., Ltd.

Manufacturer/Factory & Trading Company

Henan, China Since 2024
Chat Now Send Inquiry
High-Performance Back Grinding Wheels for Silicon Wafer Thinning

High-Performance Back Grinding Wheels for Silicon Wafer Thinning

US $ 1,500-2,500 / Piece FOB
1 Piece (MOQ)
More
Grain Size : 280#
Contact Supplier
Audited Supplier
Zhengzhou Yaxin Superhard Materials Co., Ltd.

Manufacturer/Factory

Henan, China Since 2025
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Metal Bond Diamond Abrasive Back Thinning Wheel for LED Epitaxial Wafer Processing

Metal Bond Diamond Abrasive Back Thinning Wheel for LED Epitaxial Wafer Processing

US $ 1,800-2,000 / pieces FOB
1 pieces (MOQ)
More
Main Products: Honing Tools, Grinding Wheels
Contact Supplier
Audited Supplier
Zhengzhou Hongtuo Precision Tools Co., Ltd.

Manufacturer/Factory & Trading Company

Henan, China Since 2024
Chat Now Send Inquiry
Metal Bond Back Grinding Wheel 6A2t Si Substrate Epitaxial Wafer Metal Bond Back Thinning Grinding Wheel

Metal Bond Back Grinding Wheel 6A2t Si Substrate Epitaxial Wafer Metal Bond Back Thinning Grinding Wheel

US $ 2,000-3,058 / Piece FOB
10 Pieces (MOQ)
More
Bonding Agent : Metal
Contact Supplier
Audited Supplier
Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
Chat Now Send Inquiry
OEM/ODM Metal Bond Back Grinding Wheel Diamond Grinding Wheel for Sapphire Wafer Thinning Lapping

OEM/ODM Metal Bond Back Grinding Wheel Diamond Grinding Wheel for Sapphire Wafer Thinning Lapping

US $ 2,000-3,058 / Piece FOB
10 Pieces (MOQ)
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Main Products: Hardware Products, Ordinary Mechanical Equipment
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Audited Supplier
Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
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High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating

High Quality Full-Automatic Semiconductor Wafers Back Grinding Equipment for Si Wafer/Glass/Metal Plating

US $ 500,000-1,000,000 / Set FOB
1 Set (MOQ)
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Function : High Temperature Resistance
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Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China Since 2023
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Silicon Wafer Back Grinding Wheel Diamond Wheel Factory Direct Supplying Wheel

Silicon Wafer Back Grinding Wheel Diamond Wheel Factory Direct Supplying Wheel

US $ 2,300-2,500 / pieces FOB
1 pieces (MOQ)
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Main Products: Honing Tools, Grinding Wheels
Contact Supplier
Audited Supplier
Zhengzhou Hongtuo Precision Tools Co., Ltd.

Manufacturer/Factory & Trading Company

Henan, China Since 2024
Chat Now Send Inquiry
Vitrified Bond Back Diamond Wheel 6A2t 6A2h Sapphire Wafer Diamond Grinding Wheel Sapphire Epitaxial Wafers

Vitrified Bond Back Diamond Wheel 6A2t 6A2h Sapphire Wafer Diamond Grinding Wheel Sapphire Epitaxial Wafers

US $ 1,858-2,450 / Piece FOB
1 Piece (MOQ)
More
Manufacturing Process : Sintered
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Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
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Semiconductor Thinner Grinding Wheel Silicon Wafer Back Grinding Wheels Diamond Cup Grinding Wheel

Semiconductor Thinner Grinding Wheel Silicon Wafer Back Grinding Wheels Diamond Cup Grinding Wheel

US $ 1,858-2,450 / Piece FOB
1 Piece (MOQ)
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Main Products: Hardware Products, Ordinary Mechanical Equipment
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Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
Chat Now Send Inquiry
Vitrified Bond Diamond Wheel Resin Back Grinding Wheel for Surface Grinding Various Silicon Wafer

Vitrified Bond Diamond Wheel Resin Back Grinding Wheel for Surface Grinding Various Silicon Wafer

US $ 1,858-2,450 / Piece FOB
1 Piece (MOQ)
More
Shape : Cup-Shaped
Contact Supplier
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Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
Chat Now Send Inquiry
High Quality Vitrified Bond Diamond Wheel Cup Grinding Wheel for Virgin Silicon Wafer Back Grinding

High Quality Vitrified Bond Diamond Wheel Cup Grinding Wheel for Virgin Silicon Wafer Back Grinding

US $ 1,858-2,450 / Piece FOB
1 Piece (MOQ)
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Main Products: Hardware Products, Ordinary Mechanical Equipment
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Audited Supplier
Zhengzhou Ruizuan Diamond Tool Co., Ltd.

Trading Company

Henan, China Since 2023
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Precision Back Grinding Wheels for Efficient Silicon Wafer Processing

Precision Back Grinding Wheels for Efficient Silicon Wafer Processing

US $ 1,500-2,500 / Piece FOB
1 Piece (MOQ)
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Shapes : Edge Shape
Contact Supplier
Audited Supplier
Zhengzhou Yaxin Superhard Materials Co., Ltd.

Manufacturer/Factory

Henan, China Since 2025
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