Jiangsu Himalaya Semiconductor Co., Ltd.
More
R&D Capacity:
OEM, ODM
Main Products:
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Year of Establishment:
2019-09-12
Categories
Chat Now
Send Inquiry
Featured Products
20W Fiber Laser Marking Machine Price for Metal PVC, Keyboard, Bearings Engraving
US$ 1,000-7,000
1 Piece(MOQ)
CCD Vision Glue Dispensing System High-Speed Dispensing for FPC Package
US$ 1,800-78,000
1 Piece(MOQ)
High Precision FPC Package Glue Dispenser Machine System Automatic Silicone Wafer Equipment Factory
US$ 5,000-35,000
1 Piece(MOQ)
View More
Hot Products
30W Automatic UV Picosecond Laser Cutting Machine for Sapphire Glass FPC
US$ 50,000-70,000/Piece
1 Piece(MOQ)
Sic GaN Wafer Laser Dicing Machine for Semiconductor Manufacturing
US$ 200,000-300,000/Piece
1 Piece(MOQ)
Automatic LED/IC Flip Chip Die Bonding Machine
US$ 100,000-1,000,000/Piece
1 Piece(MOQ)
Laser Trimming System Machine for Circuit Component Chip Resistor Semiconductor Wafer Trimming
US$ 100,000-1,000,000/Piece
1 Piece(MOQ)
Semiconductor Sic Sio2 Wafer Stealth Dicing Cutting Equipment
US$ 700,000-1,000,000/Set
1 Set(MOQ)
30W UV CO2 Laser Engraving Machine Mopa Acrylic Jewelry or Wafer Marking
US$ 7,000-100,000/Piece
1 Piece(MOQ)
Gold/Alloy/Copper Wire High Speed Fully Automatic Wire Bonder with 45ms/Wire
US$ 60,000-100,000/Set
1 Set(MOQ)
Epoxy Polyurethane Silicone Dispenser CCD Automated Aligning Glue Dispensing Robot
US$ 40,000-70,000/Piece
1 Piece(MOQ)
Automatic Semiconductor IC to LED Package Equipment Wire Bonder with Factory Price
US$ 60,000-170,000/Piece
1 Piece(MOQ)
20W-100W Fiber Laser Marking Machine for Metal & Plastic with Ezcad2 Software
US$ 1,000-7,000/Piece
1 Piece(MOQ)
Recommended for You
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
US$ 100,000-1,000,000/Set
1 Set(MOQ)
Fully Automatic Semiconductor Glue Coating and Developing Equipment
US$ 10,000-50,000/Piece
1 Piece(MOQ)
High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry
US$ 40,000-100,000/Piece
1 Piece(MOQ)
Automatic CCD Visual Glue Dispenser Machine
US$ 30,000-100,000/Piece
1 Piece(MOQ)
20W Fiber Laser Marking Machine Engraving for Semiconductor PCB Uid Marking
US$ 1,000-7,000/Piece
1 Piece(MOQ)
Achieve Perfect Alignment with Precision Wafer Mounting Equipment System
US$ 35,000-50,000/Piece
1 Piece(MOQ)
Fiber Laser Engraving System: High-Precision Marking and Engraving for Industrial Applications
US$ 5,000-7,000/Piece
1 Piece(MOQ)
355nm UV Laser Laser Marking Machine for True Cold Marking Plastic Glass Medical Device PCB Chip
US$ 7,000-12,000/Piece
1 Piece(MOQ)
High-Speed 1.2L Industrial Planetary Mixer with Vacuum Defoaming
US$ 9,000-12,000/Piece
1 Piece(MOQ)
4/6/8 Inch Wafer Laser Lift-off Equipment for Mino or Micro LED Enabling The Separation of GaN Epitaxial Layers From Sapphire Substrates.
US$ 70,000-120,000/Piece
1 Piece(MOQ)
Sot/Sop/Ssop/Dfn/Qfn Automated Wire Bonding Machine with Gold/Copper Wire
US$ 60,000-100,000/Set
1 Set(MOQ)
{"app": "App", "root": "#root", "props": "#ssrData", "options": {"type":"react","main":false,"router":"none","base":"","path":"","csr":false}}