Jiangsu Himalaya Semiconductor Co., Ltd.
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R&D Capacity:
OEM, ODM
Main Products:
Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Year of Establishment:
2019-09-12
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Featured Products
20W Fiber Laser Marking Machine Price for Metal, Steel, Iron, Aluminum, PVC, Keyboard, Bearings Engraving
US$ 1,000-7,000
1 Piece(MOQ)
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
US$ 100,000-1,000,000
1 Set(MOQ)
High Precision FPC Package Dispenser Machine Automatic Silicone Wafer Equipment Factory
Negotiable
1 Piece(MOQ)
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Hot Products
High End Semiconductor Fully Automatic Llo Laser Peeling Equipment
US$ 1,000,000-2,000,000/Set
1 Set(MOQ)
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
Negotiable
1 Piece(MOQ)
Tgv High-End Precision Laser Drilling Machine Suitable for Processing Brittle Materials
US$ 500,000-2,000,000/Set
1 Set(MOQ)
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
US$ 100,000-1,000,000/Set
1 Set(MOQ)
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High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
US$ 100,000-1,000,000/Set
1 Set(MOQ)
Fully Automatic Semiconductor Glue Coating and Developing Equipment
Negotiable
1 Piece(MOQ)
Industry High-End Semiconductor Fully Automatic Wafer Marking Machine
US$ 400,000-1,000,000/Piece
1 Piece(MOQ)
Semiconductor Fully Automatic IC Marking Machine
Negotiable
1 Piece(MOQ)
Frame Laser Marking Machine with Integrated Post Label Detection System
US$ 100,000-200,000/Piece
1 Piece(MOQ)
High End Semiconductor Industry Glass Wafer Laser Processing Equipment
Negotiable
1 Piece(MOQ)
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