Product Details
Product Description
High-speed chip assembly directly from wafer and SMT placement in one machine
Smart devices, 5G communication standards, autonomous driving: Only consistent miniaturization and ever-increasing complexity in electronics make all of this possible. The key technology behind this is System in Packages (SiP): ICs and SMT components are combined into a compact, highly innovative system.
As a hybrid combination of a SMT placement machine and a die bonder, the new SIPLACE CA2 can process both SMDs supplied from changeover tables and feeders as well as dies taken directly from the sawn wafer in a single work step. By integrating the complex die bonding process into the SMT line it eliminates the need for special machines in production.
Placement directly from the wafer: more cost-effective and sustainable
Discover the efficiency of direct wafer placement: By eliminating the taping process, operators have fewer replenishment and splicing tasks as well as less effort for material feeding. In just one year, 800 km of tape can be saved with 24/7 SiP production.
By air, for sample and small package, international express like DHL, UPS, EMS...
By sea, for large package and quantity;
Other ways as customer requested.
Delivery Time:
Within 35 Days.
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Q: What we can do for you?
A: One-stop SMT Solution Supplier; Reliable SMT Partner. |
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Q: Are you a trade company or manufacturer?
A: Full SMT machines maufacturer for smt line in China; OEM & ODM service are available. |
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Q: What is your delivery date?
A: About 35 days after receipt of payment. |
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Q: What is your payment terms?
A: 30% deposit in advance and 70% balance before shipment. |
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Q: What your main customers? A: Foxconn, Vtech, Sumida, Kemet, Vishay, Canon, Jabil etc. |
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Q: Why choose you? A: Leading SMT Supplier in China; Professional Supplier Trade assurance to USD 560,000+; Professional after-sales service team. |