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Customized Direct Bond Copper Metallized Aluminum Nitride Aln Ceramic Substrate for High Power Module
Purchase Qty. / FOB Price:
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US$ 5.00-45.00 / Pieces
Min. Order: 10 Pieces
1000000 PCS/Month
Quick Details
HBQ-E006
Structure Ceramic, Industrial Ceramic
Ceramic Plates
Aluminum Nitride(Aln)
Aln
120*120*3mm
Copper Plating
High Heat Conductivity
Direct Bond Copper Metallized Aluminum Nitride Aln
OEM
1.Plastic Air Cushion Film 2.Foam Material 3.Car
As per request
China
Business Type: Manufacturer/Factory & Trading Company
Lianyungang, Jiangsu, China
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