Why Ponda? Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites. Products Show APPLICATION Process Industry by Substance Industry by Applicability Single Plate Lapping & Polishing Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone Sealing valve and sealing ring(liquid, oil, gas) Semiconductor LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) Plastic PE, E/VAC, SBS, SBR, NBR, SR, BR, PR Phone Frame(flat) back plate PCB adhesive, coating, circuit Optics(flat) optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass Radar oxide coating plate Gemstone jade, sapphire, agate, etc. Others graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. *NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed. SPECIFICATION Standard Specification Machine Model FD3803 FD4603 FD6103 FD9104 Plate Diameter Φ380 mm / 15 inches Φ460mm / 18 inches Φ610mm / 24 inches Φ910mm / 36 inches Max. Workpiece Diameter (without conditioning ring) Φ180 mm Φ220 mm Φ270 mm Φ420 mm Conditioning Ring Diameter Φ180 mm Φ220 mm Φ270 mm Φ420 mm Number of Station 3 3 3 4 Plate Rotate Speed 0-140 rpm 0-140 rpm 0-120 rpm 0-90 rpm Facing & Grooving Speed (Not include in Polishing) 0-120 mm/m 0-120 mm/m 0-120 mm/m 0-120 mm/m Total Weight 450 kg 780 kg 1000 kg 1600 kg Total Floor Space 670×940 mm 1030×730 mm 1920×840 mm 2100×1300 mm Built-In Optional Kits Grade Standard Upgraded Advanced Controls Digital Digital Touch-Screen PLC Pressure Source Hand Weight Block Pneumatic Weight Block Manual Pneumatic Press Integrated with PLC Slurry Supply System - Manual Digital, Manual Cylinder Bar Drive System - Manual Integrated with PLC Conditioning Ring Drive System - Manual Integrated with PLC Machine Enclosure - Framed by Aluminum Alloy Framed by Metal Plate *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. SAMPLE DEMONSTRATION (SINGLE PLATE) Patent FAQs Q1: Which machine is most applicable for my product? A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity: 1. If better flatness and roughness were required, you might need both lapping and polishing machine. 2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra. 3. If the productivity were excessive, you might need larger machine or to expand production line. Additionally, we can confirm the production line as we make samples for you. Q2: Does Ponda charge for making samples? A: No, it's free to make samples. Q3: Is Ponda trader or manufacturer? A: We are manufacturer, certified National High-Tech Enterprise. Q4: How long does it take machine to deliver? A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture. Q5: Does Ponda provide oversea setup and after-sale service? A: Yes, we provide oversea service and online tutorial. Q6: How many type of machine does Ponda manufacture? A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.