Shenzhen Ponda Grinding Technology Co.,Ltd.

More
Business Type:Manufacturer/Factory & Trading Company
R&D Capacity:Own Brand, OEM, ODM
Main Products:Lapping Machine, Polishing Machine, Grinding Machine, Wafer Grinder, Single Plate Lapping & Polishing Machine, Double Plate Lapping & Polishing Machine, Lapping & CMP Systm, Abrasive Tools & Consumables.
Year of Establishment:2007-03-10
categories iconCategoriesChat NowSend Inquiry

Featured Products

High Precision Large Workpiece Single Plane Grinding and Polishing Machine
High Precision Large Workpiece Single Plane Grinding and Polishing Machine
US$ 8,000-240,000
1 Piece(MOQ)
Fd-9104PA CMP Cylinder-Pressurized Semiconductor Wafer Single-Side Precision Polishing Machine
Fd-9104PA CMP Cylinder-Pressurized Semiconductor Wafer Single-Side Precision Polishing Machine
US$ 8,000-240,000
1 Piece(MOQ)
China Fangda 3D Glass Grinding Machine Polishing Machine Precision Polishing Equipment
China Fangda 3D Glass Grinding Machine Polishing Machine Precision Polishing Equipment
US$ 6,000-240,000
1 Piece(MOQ)
View More

Wafer thinning machine series

China High Precision Wafer Thinning Machine Grinding Equipment Manufacturersvideo iconChina High Precision Wafer Thinning Machine Grinding Equipment Manufacturers
US$ 8,000-20,000/Piece
1 Piece(MOQ)
Shenzhen Fangda High Speed Wafer Grinder Precision Thinning Equipmentvideo iconShenzhen Fangda High Speed Wafer Grinder Precision Thinning Equipment
US$ 20,000-60,000/Piece
1 Piece(MOQ)
China Ponda High Precision Thinning for Silicon Aafers and Crystal Materials Machinevideo iconChina Ponda High Precision Thinning for Silicon Aafers and Crystal Materials Machine
US$ 8,000-20,000/Piece
1 Piece(MOQ)
Sapphire Thinning Machine Different Process Frequency Control Grindingvideo iconSapphire Thinning Machine Different Process Frequency Control Grinding
US$ 20,000-60,000/Piece
1 Piece(MOQ)
Ultra-Precision Wafer High Speed Grinding and Thinning Equipmentvideo iconUltra-Precision Wafer High Speed Grinding and Thinning Equipment
US$ 20,000-60,000/Piece
1 Piece(MOQ)
Crystal and Other Non-Metallic Materials Thinning Equipmentvideo iconCrystal and Other Non-Metallic Materials Thinning Equipment
US$ 20,000-60,000/Piece
1 Piece(MOQ)

Single Plate Lapping & Polishing Machine

All-Round Safety Consideration of Single-Side Grinding and Polishing Equipmentvideo iconAll-Round Safety Consideration of Single-Side Grinding and Polishing Equipment
US$ 8,000-240,000/Piece
1 Piece(MOQ)
China Stainless Steel Surface High Precision Grinding and Polishing Equipment Machinevideo iconChina Stainless Steel Surface High Precision Grinding and Polishing Equipment Machine
US$ 8,000-20,000/Piece
1 Piece(MOQ)
Light Guide Plate Silicon Wafer Grinding and Polishing Processing Equipmentvideo iconLight Guide Plate Silicon Wafer Grinding and Polishing Processing Equipment
US$ 8,000-20,000/Piece
1 Piece(MOQ)
New-Type Customized China High Precision Planar Single Sided Grinding and Polishing Machinevideo iconNew-Type Customized China High Precision Planar Single Sided Grinding and Polishing Machine
US$ 8,000-20,000/Piece
1 Piece(MOQ)
High-Precision Single-Sided Grinding and Polishing Equipment for Silicon Wafers Machinevideo iconHigh-Precision Single-Sided Grinding and Polishing Equipment for Silicon Wafers Machine
US$ 8,000-20,000/Piece
1 Piece(MOQ)
China High Precision Grinding and Polishing Equipment Mirror Surface Polishing Machinevideo iconChina High Precision Grinding and Polishing Equipment Mirror Surface Polishing Machine
US$ 8,000-20,000/Piece
1 Piece(MOQ)
High-Function Precision Plane Polishing Adjustable Plane Equipment Easy Operation Machinevideo iconHigh-Function Precision Plane Polishing Adjustable Plane Equipment Easy Operation Machine
US$ 8,000-20,000/Piece
1 Piece(MOQ)
China Domestic Light Guide Plate Polishing Machinevideo iconChina Domestic Light Guide Plate Polishing Machine
US$ 8,000-20,000/Piece
1 Piece(MOQ)
{"app": "App", "root": "#root", "props": "#ssrData", "options": {"type":"react","main":false,"router":"none","base":"","path":"","csr":false}}