Shenzhen Ponda Grinding Technology Co.,Ltd.

Since 2021Audited SupplierMore
Business Type:Manufacturer/Factory & Trading Company
R&D Capacity:ODM, OEM, own brand
Main Products:Lapping Machine, Polishing Machine, Grinding Machine, Wafer Grinder, Single Plate Lapping and Polishing Machine, Double Plate Lapping and Polishing Machine, Lapping and CMP Systm, Abrasive Tools and Consumables

Featured Products

Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines
Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines
US$ 8,000-20,000
1 Piece(MOQ)
Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
Wafer Thinning Ceramic Silicon Carbide Precision Thinning Machine
US$ 20,000-60,000
1 Piece(MOQ)
High-Quality Precision Surface Grinding Machine From High-Tech Enterprises in China
High-Quality Precision Surface Grinding Machine From High-Tech Enterprises in China
US$ 6,000-240,000
1 Piece(MOQ)
{"app": "App", "root": "#root", "props": "#ssrData", "options": {"type":"react","main":false,"router":"none","base":"","path":"","csr":false}}