Dalian Jafeng Electronics Co., Ltd.

Dalian Jafeng Electronics Co., Ltd. focusing on the R&D, manufacture with sale of semiconductor back-end package equipment, is one professional manufacturer of die bonders which are used for the Transistor, ICs, LED, Crystal Oscillator, IC card etc package. It sells well due to its high quality, competitive price, and so we win the most of the VIP by its advance technology, high reliability and excellent working team in short time.

Our products are:
*Soft Solder Die Bonders---for Transistor Package: TO-126 TO-220 TO-23 TO-3P etc;
*Epoxy Die Bonder---for IC LED DIP SOP SIP TSOP QFP LQFP PLCC SSOP BGA IC Card Crystal Oscillator etc package;
*COG Bonder--- For LCD package;
*RFID Flip Chip Bonder---For Flip Chip package.