Dongguan Keraf Electronic Technology Co., Ltd.

Desde 2023Proveedor AuditadoMás
Tipo de Negocio:Manufacturer/Factory
Capacidad de R&D:OEM, ODM, Own Brand
Productos Principales:Graphite Sheet and Die Cutting Parts Thereof, Die-Cut Components for The Electronics Industry, Auxiliary Materials for The Semiconductor Field, Industrial Materials for Coating or Components, Hardware Plastic Design and Manufacturing, LSR Processing and Assembly Parts Thereof
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All Metal Hardware, plastic design and manufacturing Graphite sheet and die cutting parts thereof Others LSR processing and assembly parts thereof Industrial materials for coating or components Auxiliary materials for the semiconductor field Die-cut components for the electronics industry
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Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing

US $ 10-12.5/Square MeterFOB
MOQ:30 Square Meters
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Nitto 224 0.08mm Blue PVC Protection Film Non UV Dicing Semiconductor Wafer Processing Tape for Surface Protection

US $ 2-3/Square MeterFOB
MOQ:30 Square Meters
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Maxell Sliontec 160micron Matte Translucent Single-Sided Coated UV Release Type Pressure-Sensitive Adhesive with Po Film for Dicing of Various Wafers

US $ 9.5-10/Square MeterFOB
MOQ:30 Square Meters
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