Suzhou Bozhon Semiconductor Co., Ltd
से दरें 2023
लेखापरीक्षित आपूर्तिकर्ताव्यवसाय के प्रकार:Manufacturer/Factory & Trading Company
रिसर्च एंड डेवलपमेंट विभाग की क्षमता:ODM, own brand
मुख्य उत्पाद:Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
स्थापना वर्ष:2022-01-21
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High Precision Submicron Placement Accuracy Die Bonder Machine
US $ 200,000-300,000/setFOB
MOQ:1 set
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Semiconductor High Precision COB Smart Die Bonding Machine
US $ 100,000-300,000/PieceFOB
MOQ:1 Piece
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Automatic Molding Machine for High Power Lasers Epoxy Dispensing Equipment
US $ 100,000-300,000/PieceFOB
MOQ:1 Piece
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High Precision Die Bonding and Epoxy Dispensing Systems Machine
US $ 250,000-450,000/PieceFOB
MOQ:1 Piece
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High Precision Eutectic &Exopy Die Attach Chip Solder Machine
US $ 200,000-450,000/PieceFOB
MOQ:1 Piece
