Jiangsu Himalaya Semiconductor Co., Ltd.

Depuis 2023Fournisseur AuditéPlus
Type d'Entreprise:Trading Company
Capacité de R&D:ODM, OEM
Produits Principaux:Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Année de Création:2019-09-12
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Drying Furnace Drying and Sizing of Electronic Materials

US $ 100,000-1,000,000/PieceFOB
MOQ:1 Piece
3/4

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