Jiangsu Himalaya Semiconductor Co., Ltd.
อัตราจาก 2023
ซัพพลายเออร์ที่ผ่านการตรวจสอบแล้วประเภทของธุรกิจ:Trading Company
ความสามารถในการวิจัยและพัฒนา:ODM, OEM
ผลิตภัณฑ์หลัก:Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
ปีที่ก่อตั้ง:2019-09-12
All
Laser Marking Machine
Laser Grooving
Laser Cutting Machine
Wafer Saw
Stepper
TGV
Test
Fully automatic IC reel packaging equipment
PCBA Coating Machine
Laser Debonding
Semiconductor Equipment
AGV
Dispensing machine
SIC laser annealing
stealth dicing
Wafer Marking
Laser IC/ID Marking
Furnace
wire bonding machine
Fully Automatic Lead Wire Bonding Bonder Machine with High Efficiency/Accuracy/ Consistency in Bonding
US $ 100,000-1,000,000/PieceFOB
MOQ:1 Piece
Hybrid Circuits Microwave Devices Fully Automatic Lead Wire Bonding Machines
US $ 100,000-1,000,000/PieceFOB
MOQ:1 Piece
High Resolution Optical Lens Improves Line Quality Wafer Bonding Machine
US $ 100,000-1,000,000/PieceFOB
MOQ:1 Piece
Semiconductor Devices Automatic High-Speed Lead Wire Welding and Bonding Machine
US $ 100,000-1,000,000/PieceFOB
MOQ:1 Piece
Jdh-400 Flip Chip Bonding Machine for Large-Scale Integrated Circuit Device
US $ 100,000-1,000,000/PieceFOB
MOQ:1 Piece
Qxh-3116 Fully Automatic Lead Wedge Welding and Bonding Machine
US $ 100,000-1,000,000/PieceFOB
MOQ:1 Piece
Wafer Bonding Equipment for Hot Pressing Bonding/Eutectic Bonding/Melt Bonding
US $ 100,000-1,000,000/PieceFOB
MOQ:1 Piece
Video
Wafer Substrate Bonder Machine with Automatic Optical Focusing Integration Technology
US $ 100,000-1,000,000/PieceFOB
MOQ:1 Piece
