Type: | Paste |
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Material: | Tin |
Flux Containing: | Containing Flux |
Slag Characteristic: | Syringe Method Continuous out of Tin Stability |
Extended Length: | Coating |
Colour: | Grey |
Samples: |
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Customization: |
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Suppliers with verified business licenses
Name | Lead-free solder paste |
Alloy | Sn-1.0Ag-0.5Cu |
Material | Tin |
Package | 500g/bottle |
Melting point | 217-224ºC |
Particles | 25 - 45um(custom made) |
Application scenario | Widely used in SMT industry. Suitable for smart phone, tablet computer, computer motherboard, computer peripheral, bluetooth headset, TV, monitor, etc |
Suppliers with verified business licenses