Product Description
Specifications:
Features:
- The integration of the board design is very high, with a thickness-to-diameter ratio exceeding 10:1, and high difficulty in electroplating of copper.
- Made of TG170 material.
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About Shenzhen Xinmanda Printed Circuit Board Co., Ltd.
Shenzhen XMD Circuits Co., Ltd., previously known as Jaleny (jlypcb), was founded in 2009 in Shenzhen, China. With over 12 years of experience in PCBs, we offer one-stop solutions for clients, including PCB & PCBA services. Our production capacity allows us to produce 50,000 sqm of PCBs monthly. We comply with RoHS, TS16949, ISO9001, and UL certifications.
Production Highlights:
- High-quality raw materials with traceable sources
- Standardized procurement process and strict supplier selection policy
- High precision processing equipment ensuring quality
- Intelligent systems for improved efficiency
- Strict inspection with 100% AOI testing and FQA/FQC
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Our professional team utilizes automation and digitization to enhance PCB production efficiency and reduce procurement costs. We offer flexibilities in shipment arrangements and have a quick response time with experienced engineers to serve you.
Our Capabilities and Technology |
Items |
2022 |
2023 |
Layers |
(MP):22layer,(Sampling):32 layer |
(MP):32layer |
Max. Board THK |
Sampling 4.0mm / MP :3.2mm |
Sampling 5.0mm / MP:3.2mm |
Min. Board THK |
Sampling :0.4mm /MP :0.5mm |
Sampling: 0.3mm / MP:0.4mm |
Base copper |
Inner layer |
1/3 ~ 6OZ |
1/3~8 OZ |
Outer layer |
1/3 ~ 6 OZ |
1/3 ~ 8 OZ |
Borehole diameter |
Min.PTH |
0.2mm |
0.15mm |
Max. aspect ratio |
10:01 |
12:01 |
HDI aspect ratio |
0.8:1 |
1:01 |
Tolerances |
PTH |
±0.076mm |
±0.05mm |
NPTH |
±0.05mm |
±0.03mm |
Solder mask opening |
0.05mm |
0.03mm |
Solder dam |
(Green) 0.076mm , |
(Green) 0.076mm , |
(other color) 0.1mm |
(other color) 0.08mm |
Min. core THK. |
0.1mm |
0.08mm |
Bow&twist |
≤0.5% |
≤0.5% |
Routing Tol. |
Sampling :±0.075mm /MP:±0.1mm |
Sampling:±0.075mm /MP:±0.075mm |
Impedance Tol. |
±10% |
±8% |
Min. w/s (Inner layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
Min. w/s (Outer layer) |
0.075 / 0.075mm |
0.075 / 0.075mm |
(Min. BGA size) |
0.2mm |
0.15mm |
(pitch)(Min. BGA Pitch) |
0.65mm |
0.5mm |
(Working panel size) |
600mm*700mm |
600mm*700mm |
Special process |
Split gold fingers, Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling Blind hole. |