| Dielectric: | Alumina Ceramic |
|---|---|
| Finished Product: | Ceramic Circuit Board |
| Substrate Material: | 96%, 99.6% Alumina |
| Usage: | to Realize Electrical Connections |
| Transport Package: | Vacuum Packaging |
| Specification: | According to the Drawing |
| Customization: |
|---|
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Audited Supplier In view of the advantages of ceramics such as good thermal conductivity, heat resistance, high insulation, high strength, low thermal expansion,
corrosion resistance and radiation resistance, ceramic substrates are widely used in power devices and high-temperature electronic device
packaging.
At present, ceramic substrate materials mainly include Al2O3, AlN, Si3N4, SiC, BeO and BN. Because Al2O3 and AlN have good comprehensive
properties, they occupy the mainstream in the low-end and high-end ceramic substrate markets respectively, while Si3N4 substrate is expected to
play an important role in the packaging of high-power, large-temperature-changing power electronic devices (such as IGBT) in the future due to its
high bending strength.
There are many metallization methods on the surface of ceramic substrates, among which the silver firing method is widely used because of its
mature and stable process. The sintering mechanism of the silver firing method:
1. Reducing silver-containing raw materials into silver particles;
2. Melting the solvent into a melt;
3. The melt bonds the silver particles together to form a silver layer;
4. The silver layer is fixed on the surface of the ceramic substrate.
Jinghui is a professional manufacturer of metallized ceramic substrates. It is our goal to provide ideal solutions for customers' different application
requirements. Whether it is cost or engineering solutions, our goal is to find the most economical and suitable solution for our customers!
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Audited Supplier 
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