| After-sales Service: | Online |
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| Warranty: | 1 Year |
| Cleaning Process: | Plasma Cleaning |
| Clean Type: | High Pressure Cleaning |
| Usage: | Petrochemical Industry, Pharmaceutical,Food Industry |
| Principle: | Physical Cleaning |
| Samples: |
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| Customization: |
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Suppliers with verified business licenses
Audited Supplier Outline:
Vacuum Plasma Cleaner(Plasma cleaner),the gas is separated into plasma state through the excitation power supply, and the plasma ACTS on the product surface to clean the pollutants on the product surface, so as to improve the surface activity and enhance the adhesion.Plasma cleaning is a new, environmental protection, efficient and stable surface treatment.
Rotating Nozzle Plasma Surface Processor Cleaning Machine Plasma Cleaning Machine Apparatus
Product feature:
1.Product placement fixture flexible, can adapt to irregular products
2.Horizontal electrode design can meet the requirements of soft product processing.
3.Low energy and gas consumption products.
4.Convenient way to put up and down the board
5.Vacuum system integration, small footprint
6.Reasonable plasma reaction space, so that the treatment is more uniform
7.Integrated control system design makes operation more convenient
Rotating Nozzle Plasma Surface Processor Cleaning Machine Plasma Cleaning Machine Apparatus
Industry application:
1.Mobile phone industry: TP, middle frame, back cover surface cleaning activation
2.PCB/FPC industry: hole drilling and surface cleaning, Coverlay surface coarsening and cleaning
3.Semiconductor industry: semiconductor packaging, camera module, LED packaging, BGA packaging, 4.Wire Bond pretreatment
5.Ceramics: packaging, pre-treatment of glue
6.Surface roughening etching: PI surface roughening, PPS etching, semiconductor silicon chip PN junction removal, ITO film etching
7.Plastic materials: Teflon surface activation, ABS surface activation, and other plastic material cleaning activation
8.Clean the surface before applying ITO
Rotating Nozzle Plasma Surface Processor Cleaning Machine Plasma Cleaning Machine Apparatus
Specification of equipment:
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Power system |
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medium-frequency power supply |
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power |
0~600W |
0~2000W |
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frequency |
13.56MHz |
40KHz |
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Vacuum plant |
Double-stage vane pump (oil pump)
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60m3/h |
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All stainless steel piping and high strength vacuum bellows |
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texture |
Aluminum alloy (customizable stainless steel cavity) |
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thickness |
25mm |
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leakproofness |
Military grade welding seal |
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Cavity internal dimensions |
4450×450×500mm (width × height × depth) |
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Effective size of electrode plate |
420×411mm(width × depth) |
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Available space spacing |
22.5mm |
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Electrode layout
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Horizontal arrangement, activity extraction
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Work tray |
Standard one set, material optional (aluminum, steel wire mesh) |
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8 layer |
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Gas system |
flow range |
0~300SCCM |
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Process gas path |
Standard with two, can be customized |
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Control system |
systems control |
PLC |
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delivery method |
7 inch touch screen |
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Other parameters |
boundary dimension |
900×1750×1000mm(w×h×d) |
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weight |
200KG |
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Equipment appearance color |
silver gray |
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Rotating Nozzle Plasma Surface Processor Cleaning Machine Plasma Cleaning Machine Apparatus
Factory specifications:
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Factory specifications |
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Ac power specification
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Factory exhaust
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Flow:2.0 m³/min |
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Gas requirements for plant work
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Flow:1~10 L/min Pressure:3~7 kg/cm² Pipe diameter:6×4 mm Texture:PU pipe Purity:More than 99.99% |
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Factory compressed air requirements
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Flow:1~10 L/min Pressure:3~7 kg/cm² Pipe diameter:8×5 mm Texture:PUpipe Dew point:-40ºC under Particle>0.3μm:10Pcs/ft³ |
Rotating Nozzle Plasma Surface Processor Cleaning Machine Plasma Cleaning Machine Apparatus
2.3 General Requirements
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General requirements |
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Risk identification |
High pressure hazard identification
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Service environment |
temperature:15~30ºC humidity:30~70% |
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Other matters needing attention |
No combustible gases, corrosive gases, explosions or reactive dust Gas cylinders need to be fixed |
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Configuration list |
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Serial Number |
Name |
description |
unit |
quantity |
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1 |
Main engine |
boundary dimension:900×1750×1000mm (width × height × depth) |
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1 |
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2 |
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Aluminum alloy vacuum chamber
(width × height × depth) |
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1 |
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3 |
Excitation power supply |
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edium-frequency power supply |
cover |
1 |
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Power 0 ~ 600 w Or 0~1000W is optional; Fully automatic vacuum capacitor matching unit |
0~1000W;
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4 |
PLC |
Siemens,S7-200 |
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1 |
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5 |
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Wei lun tong,7 inch screen,MT6071iE |
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1 |
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6 |
Flowmeter |
British wawick brand |
individual |
2 |
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7 |
Vacuum pump |
Flyover double-stage vane pump (oil pump):60m3/h |
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1 |
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8 |
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The fu kang |
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1 |
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9 |
Specification |
Vacuum plasma cleaning machine spv-100 operation manual |
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1 |
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Rotating Nozzle Plasma Surface Processor Cleaning Machine Plasma Cleaning Machine Apparatus
Optional table:
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Optional table |
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excitation power supply |
radio-frequency power supply |
medium-frequency power supply |
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Shengding customized power supply:
Power 0~600W or 0~1000W choosable;
Fully automatic vacuum capacitor matching unit.
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frequency40KHz,power 1000W
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America CERESPower supply: frequency13.56MHz; Power 0~600W or 0~1000Wchoosable ; American CERES automatic vacuum capacitor matcher |
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vacuum pump |
Germany laibao double-stage vane pump (oil pump):60m3/h |
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Flyover double-stage vane pump (oil pump):60m3/h |
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Suppliers with verified business licenses
Audited Supplier 
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