| Structure: | Multilayer FPC |
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| Material: | Polyimide |
| Combination Mode: | Without Adhesive Flexible Plate |
| Application: | Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace |
| Conductive Adhesive: | Conductive Silver Paste |
| Flame Retardant Properties: | HB |
| Samples: |
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| Customization: |
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Suppliers with verified business licenses
Audited Supplier | Size of Flexible PCB | 41.5X 112.3mm |
| Number of Layers | 2 |
| Board Type | Flexible PCB |
| Board Thickness | 0.15mm |
| Board Material | Polyimide (PI) 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60ºC |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 70um |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | Polyimide |
| Stiffener Thickness | 0.2mm |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 1 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90ºC No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25ºC±125ºC, 1000 cycles. |
| Thermal Stress | Pass, 300±5ºC,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
International Certificates
All of our PCB and PCBA are ISO, TS, RoHS and UL approved.
Quality Guarantee is the basis of our clients' trust.
Suppliers with verified business licenses
Audited Supplier 
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