Jiangsu Himalaya Semiconductor Co., Ltd.

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R&D Capacity:OEM, ODM
Main Products:Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Year of Establishment:2019-09-12
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Advanced UV Laser Marking Machine for PCBA Parts

US $ 1,000-7,000/PieceFOB
MOQ:1 Piece
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High-Precision Green and UV Laser Wafer Marking Machine

US $ 50,000-100,000/PieceFOB
MOQ:1 Piece
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