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  • PCB Assemble, PCB Design Printed Circuit Boards and Processing, HDI PCB, High-Density PCB
  • PCB Assemble, PCB Design Printed Circuit Boards and Processing, HDI PCB, High-Density PCB
  • PCB Assemble, PCB Design Printed Circuit Boards and Processing, HDI PCB, High-Density PCB
  • PCB Assemble, PCB Design Printed Circuit Boards and Processing, HDI PCB, High-Density PCB
  • PCB Assemble, PCB Design Printed Circuit Boards and Processing, HDI PCB, High-Density PCB
  • PCB Assemble, PCB Design Printed Circuit Boards and Processing, HDI PCB, High-Density PCB

PCB Assemble, PCB Design Printed Circuit Boards and Processing, HDI PCB, High-Density PCB

Gold Member Since 2013

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Manufacturer/Factory

Basic Info.

Model NO.
FL092
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Metal Composite Materials
Brand
FL
Board Material
Fr-4 (Tg 135 )
Board Thickness
1.6 mm
Copper Thickness
1 Oz (35um)
Surface Treatment
HASL Lead Free
Solder Mask
Blue
Silk Screen
White
Flying Probe Test
Yes
Product Name
12 Layer High Density Interconnect PCB HDI PCB
Transport Package
Vacuum Packing
Specification
Certificates: UL, ROHS
Trademark
FL
Origin
China
HS Code
8534009000
Production Capacity
20000 Square Meter/Mon

Product Description

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Gold Member Since 2013

Suppliers with verified business licenses

Manufacturer/Factory
Registered Capital
5000000 RMB
Plant Area
>2000 square meters