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Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles pictures & photos

Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles pictures & photos

Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles pictures & photos

Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles

CAS No.:	M350
Formula:	Resin Glue Joint
EINECS:	M350
Bonding Function:	Structural Adhesive
Morphology:	Solid-State
Application:	Construction, Fiber & Garment

Samples:	US$ 50/Square Meter 1 Square Meter(Min.Order) \| Request Sample

Customization:	Available \| Customized Request

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Hinson Composite Technology Co., Ltd.

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Product Description

Company Info.

Basic Info.

Model NO.

M350

Material

Epoxy

Classification

Pressure-Sensitive

Main Agent Composition

Thermoplastic Resin

Characteristic

Weatherability

Promoter Composition

Curing Agent

Composition

Inorganic Material

Color

Black

Curing Temperature

150c

Curing Time

20 Mins

Expansion Ratio

20

Tensile Elongation Before Curing

30%

Denisty

0.40+/-0.05 g/cm3

Transport Package

Plastic Bag and Paper Box

Specification

0.10mm - 0.15 mm

Trademark

Non

Origin

China

Production Capacity

10000 Square Meters One Month

Product Description

Medium temperature curing low-density epoxy adhesive solid particles
Low-density epoxy foam cement, which is inherently viscous at room temperature, is soft and not sticky. It can be kneaded into a variety of special shapes as the embedded shape of the molded part; it can also be pre-formed into a density of about 0.20~0.35 by hot pressing with a mold. A kind of special-shaped foam parts (such as bicycle internal parts), and then paste the yarn for secondary molding. There is no need to brush or paste the film. The carbon cloth is directly pressed and molded. After fully cured, the heat deformation temperature can be> 150 ºC. The bonding strength of the dipping material interface is good, and the parts can be hot-opened.

Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles

Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles

Application:

Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles

Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles

Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles

Medium Temperature Curing Low-Density Epoxy Adhesive Solid Particles

Condition of USE :

Preheat the mold to 60-80ºC, apply the release agent for moulding, and insert the styrofoam into the mould. The slices need to be spread to all parts of the mould. The thick part of the mould cavity needs to be filled with more materials as appropriate, clamping the mould, and moulding at 150ºC for 5~ 15min. After cooling to 80°C, it will be ejected from the mold with a carbon cloth for secondary molding. It will expand above 120°C and provide expansion force. The secondary ejection still needs to be cooled to 80°C for ejection, and the coating temperature should not exceed 100°C. Storage conditions: It can be stored for 3 months at 25°C. The shelf life below 5°C is 12 months.

Details :

Outward appearance	White self-adhesive mass
Natural foaming ratio	3-5 times
Volatile content	<0.3 %
Bulk density	0.40+/-0.05 g/cm3
Part forming conditions (2cm thickness)	150ºC / 15 mins
	140ºC / 20 mins
	120ºC / 40 mins
Denisty of curing	D60
Strength of pressure	>25 MPA
Heat distortion temperature after foaming	Denisty 0.20 / >130ºC
	Denisty 0.25 / >135ºC
	Denisty 0.35 / >150ºC

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Hinson Composite Technology Co., Ltd.

Gold Member Since 2021

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Audited Supplier

Trading Company

Registered Capital

73901.09 USD

Plant Area

86.5 square meters