| Refractoriness (℃): | 1200 < Refractoriness < 1400 |
|---|---|
| Type: | Refractory Material |
| Shape: | Rectangular or Square |
| Material: | 96% Alumina Ceramic |
| Forming Method: | Tape Casting |
| Features: | High Mechanical Strength, Small Dielectric Loss |
| Samples: |
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| Customization: |
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The Differences Between Ceramic Substrates and Traditional PCB Boards
1. Different materials.
Most of the ceramic bases used in ceramic substrates are alumina, aluminum nitride or silicon nitride ceramics, which are inorganic materials. Traditional PCB boards use FR4 glass fiber boards, which are organic materials.
2. Different production process, cost and lead time.
The ceramic substrate is fragile and cannot be pressed together. And because of its high hardness and density, the production process is much more difficult than the traditional PCB board, and the requirements for the technology are relatively high. In addition, the material cost and production cost of the ceramic substrate are relatively high, and the lead time is also longer. Traditional PCB boards can be pressed in multiple layers, and the processing technology is mature.
3. Different applications.
Ceramic substrates are used in industries that require high heat dissipation, such as high-power LED lighting, high-power modules, high-frequency communications, track power supplies, etc. Traditional PCB boards are more widely used, and the demand is relatively large.
Material Properties of Alumina Ceramic Substrates
| Alumina Ceramic Substrate | |||
| Item | Unit | 96% Al2O3 | |
| Mechanical Properties | |||
| Color | / | / | White |
| Density | Drainage Method | g/cm3 | ≥3.70 |
| Light Reflectivity | 400nm/1mm | % | 94 |
| Flexural Strength | Three Point Bending | MPa | >350 |
| Fracture Toughness | Indentation Method | MPa·m1/2 | 3.0 |
| Vickers Hardness | Load 4.9N | GPa | 14 |
| Young's Modulus | Stretching Method | GPa | 340 |
| Water Absorption | % | 0 | |
| Camber | / | Length‰ | T≤0.3: ≤5‰, Others: ≤3‰ |
| Thermal Properties | |||
| Max. Service Temperature (Non-loading) | / | ºC | 1200 |
| CTE (Coefficient of Thermal Expansion) |
20-800ºC | 1×10-6/ºC | 7.8 |
| Thermal Conductivity | 25ºC | W/m·K | >24 |
| Thermal Shock Resistance | 800ºC | ≥10 Times | No Crack |
| Specific Heat | 25ºC | J/kg·k | 750 |
| Electrical Properties | |||
| Dielectric Constant | 25ºC, 1MHz | / | 9.4 |
| Dielectric Loss Angle | 25ºC, 1MHz | ×10-4 | ≤3 |
| Volume Resistivity | 25ºC | Ω·cm | ≥1014 |
| Dielectric Strength | DC | KV/mm | ≥15 |
1. Product Specification
Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.
| Alumina Ceramic Substrate | |||||||
| 96% Al2O3 | |||||||
| Thickness (mm) | Maximum Size (mm) | Shape | Molding Technique | ||||
| As Fired | Lapped | Polished | Rectangular | Square | Round | ||
| 0.25 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.3 | 120 | 114.3 | 114.3 | √ | Tape Casting | ||
| 0.38 | 140×190 | √ | Tape Casting | ||||
| 0.5 | 140×190 | √ | Tape Casting | ||||
| 0.635 | 140×190 | √ | Tape Casting | ||||
| 0.76 | 130×140 | √ | Tape Casting | ||||
| 0.8 | 130×140 | √ | Tape Casting | ||||
| 0.89 | 130×140 | √ | Tape Casting | ||||
| 1 | 280×240 | √ | Tape Casting | ||||
| 1.5 | 165×210 | √ | Tape Casting | ||||
| 2 | 500×500 | √ | Tape Casting | ||||
| Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping. | |||||||
| 96% Alumina Ceramic Substrate | ||||
| Item | Substrate Thickness (mm) | Standard Tolerance (mm) | Best Tolerance (mm) | Laser Cutting Tolerance (mm) |
| Length and Width Tolerance | / | ±2 | ±0.15 | |
| Thickness Tolerance | T<0.3 | ±0.03 | ±0.01 | |
| 0.30-1.0 | ±0.05 | ±0.01 | ||
| T>1.0 | ±10% | ±0.01 | ||
3. Surface Roughness
| 96% Alumina Ceramic Substrate | ||
| Surface Roughness (μm) | ||
| As Fired | Lapped | Polished |
| Ra 0.2-0.75 | Ra 0.3-0.7 | Ra ≤0.05 |
| Alumina Ceramic Substrate | |
| Hole Diameter (mm) | Standard Tolerance (mm) |
| φ≤0.5 | 0.08 |
| φ>0.5 | 0.2 |
| Alumina Ceramic Substrate | |
| Substrate Thickness (mm) | the Percentage of Laser Scribe Line Depth to Thickness (%) |
| 0.2-0.3 | 40%±5% |
| 0.3<T≤0.5 | 50%±3% |
| 0.5<T≤1.0 | 43%±3% |
| 1.2 | 55%±3% |
| 1.5 | 55%±3% |
| 2.0 | 55%+10% |
| The scribing spot can be in different sizes. Generally there are small spot 0.03-0.04mm (Substrate Thickness≤0.5mm ) and large spot 0.08-0.1mm (Substrate Thickness>0.5mm), and the accuracy is ±0.01mm. | |
Q1: What is the Maximum ServiceTemperature of the Alumina Ceramic Substrates?
Alumina ceramic substrates can withstand high temperature of 1200-1400 ºC.
Q2: Can You Produce Alumina Ceramic Substrates in Different Colors?
Currently, we have been producing alumina ceramic substrates in optional colors such as white, ivory, pink, and black.
Q3: Do the Bare Ceramic Substrates Meet the Requirements for Metallized Ceramic Circuit Boards?
Yes. Metallized ceramic substrates, also known as metallized ceramic circuit boards, include bare ceramic substrates and metal circuit layers. Bare ceramic substrates are widely used in integrated circuit packaging, LED lighting, heat dissipation substrates and other fields in the electronic industry due to their advantages of thinness, high temperature resistance, high electrical insulation performance, low dielectric loss, and good chemical stability.
Q4: What is the Maximum Thermal Conductivity of Your Bare Alumina Substrates?
Although Al2O3 ceramics is currently the most mature ceramic substrate material, its thermal conductivity is relatively low (99% Al2O3: more than 30W/m·K). For this reason alumina ceramic substrates is limited in the application of high frequency, high power and very large-scale integration (VLSI).
Q5: Can We Get Free Samples?
Samples of standard sizes are free, and we only charge for shipping. If customization is required, we only collect sample fee for MOQ.
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