| After-sales Service: | Provide |
|---|---|
| Warranty: | 12 Months |
| Laser Type: | Fiber Laser/UV Laser |
| Certification: | ISO |
| Condition: | New |
| Function: | Laser Resistor Trimming |
| Customization: |
|---|
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| System Parameters | |||
| Hi-Precision Laser Resistor Trimming System Solution Parameters | |||
| Laser | Configurations | HTS800-RH | HTS801-RH |
| Laser type | Fiber lase | UV lase | |
| Central wavelength | 1064nm | 355nm | |
| Output power | 20W | 1W/4W(optional | |
| Repeated frequency | 1-100kHz | 1-500kHz | |
| Pulse width | 3-500ns | <15ns | |
| Typical spot size | 15-40um | 10-15μm | |
| Laser Beam Positioning |
Scan range | 70mm*70mm | 50mm*50mm |
| Scan resolution | lμm | lμm | |
| Repeated positioning | ±1μm | ±1μm | |
| Vision | Coaxial monitoring | 500W pixel surveillance camera | |
| Side axis positioning system | 500W pixel camera,with CCD intelligent controller (optional | ||
| Work platform |
Moving platform | Linear motor with grating ruler | |
| Moying range | 200mm*300mm | ||
| Repeated positioning | ±2um | ||
| Max moving speed | 1000mm/s | ||
| Measure- ment System |
Test system compatibility | Compatible with low/medium/high resistance measurement | |
| Test method | 2-wire or 4-wire measurement | ||
| Resistance measurement | Measuring range 50mQ~100MQ | ||
| Low resistance:±0.05%+0.5%/R(Q),Medium resistance:±0.05%,High resistance:±0.05%+0.05%xR(MQ) | |||
| Voltage measurement | Measurement range -10V~+50V,full range measurement accuracy is 0.01% | ||
| Measurement channe | 48~288 (each board has 48 channels,expandable) | ||
| Measurement time | 2us/time,can be adjusted according to customer needs | ||
| Error compensation | One-key automatic calibration | ||
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment
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