| Metal Coating: | Copper |
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| Mode of Production: | SMT |
| Layers: | Multilayer |
| Base Material: | FR-4 |
| Certification: | RoHS, CCC, ISO, UL |
| Customized: | Customized |
| Samples: |
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| Customization: |
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Suppliers with verified business licenses
Audited Supplier | 1 | SMT assembly including BGA assembly |
| 2 | Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP |
| 3 | Component height: 0.2-25mm |
| 4 | Min packing: 0204 |
| 5 | Min distance among BGA : 0.25-2.0mm |
| 6 | Min BGA size: 0.1-0.63mm |
| 7 | Min QFP space: 0.35mm |
| 8 | Min assembly size: (X*Y): 50*30mm |
| 9 | Max assembly size: (X*Y): 350*550mm |
| 10 | Pick-placement precision: ±0.01mm |
| 11 | Placement capability: 0805, 0603, 0402 |
| 12 | High pin count press fit available |
| 13 | SMT capacity per day: 80,000 points |
| Lines | 9(5 Yamaha,4KME) |
| Capacity | 52 million placements per month |
| Max Board Size | 457*356mm.(18"X14") |
| Min Component size | 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP |
| Speed | 0.15 sec/chip,0.7 sec/QFP |
| Lines | 2 |
| Max board width | 400 mm |
| Type | Dual wave |
| Pbs status | Lead-free line support |
| Max temp | 399 degree C |
| Spray flux | add-on |
| Pre-heat | 3 |
| Production capacity of hot-sale products | |
| Double Side/Multilayer PCB Workshop | Aluminum PCB Workshop |
| Technical Capability | Technical Capability |
| Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFON | Raw materials: Aluminum base, Copper base |
| Layer: 1 layer to 20 Layers | Layer: 1 layer and 2 Layers |
| Min.line width/space: 3mil/3mil(0.075mm/0.075mm) | Min.line width/space: 4mil/4mil(0.1mm/0.1mm) |
| Min.Hole size: 0.1mm(dirilling hole) | Min.Hole Size: 12mil(0.3mm) |
| Max. Board size: 1200mm* 600mm | Max.Board size: 1200mm* 560mm(47in* 22in) |
| Finished board thickness: 0.2mm- 6.0mm | Finished board thickness: 0.3~ 5mm |
| Copper foil thickness: 18um~280um(0.5oz~8oz) | Copper foil thickness: 35um~210um(1oz~6oz) |
| NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mm | Hole position tolerance: +/-0.05mm |
| Outline Tolerance: +/-0.13mm | Routing outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mm |
| Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK. | Surface finished: Lead-free HASL, immersion gold(ENIG), immersion silver, OSP, etc |
| Impedance control tolerance: +/-10% | Remain thickness tolerance: +/-0.1mm |
| Production capability: 50,000 s.q.m/month | MC PCB Production capability: 10,000 s.q.m/month |
| Category | Quickest Lead Time | Normal Lead Time |
| Double-sided | 24hrs | 120hrs |
| 4 Layers | 48hrs | 172hrs |
| 6 Layers | 72hrs | 192hrs |
| 8 Layers | 96hrs | 212hrs |
| 10 Layers | 120hrs | 268hrs |
| 12 Layers | 120hrs | 280hrs |
| 14 Layers | 144hrs | 292hrs |
| 16-20 Layers | Depends on the specific requirements | |
| Above 20 Layers | Depends on the specific requirements | |
Suppliers with verified business licenses
Audited Supplier 
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