• Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation
  • Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation
  • Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation
  • Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation
  • Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation
  • Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

Molecular Principal Chain: Carbon Chain Polymer
Color: Black
Appearance: Yellow/Black/Milky White
Mixing Ratio: 10:3
Usage: Construction, Fiber & Garment, Footwear & Leather.
Certificate: RoHS, Reach, PAHs, ASTM, En-71
Samples:
US$ 9.5/kg 1 kg(Min.Order)
| Request Sample
Customization:
Gold Member Since 2020

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Manufacturer/Factory, Trading Company

Basic Info.

Model NO.
WD5885AB
Type
Liquid Glue
Classification
Double Components Adhesives
Supply Ability
100 Ton/Tons Per Month
OEM
Avaliable
Shelf Life
6 Months
Cure Condition
Room Temperature
Advantage
Bubble Free and Self Leveling
Hardness
70~85
Transport Package
Barrel
Specification
5kg per bottle
Trademark
SWETE
Origin
China
Production Capacity
50000 Kilogram/Kilograms Per Week

Product Description

Products Description

The WD5885AB Silicone Coating is a low viscosity neutral silicone with a solids content of 100%, easy to spray, dip, brush or cast. Protective coating for hard and soft printed circuit boards and protective coating of impregnated porous substrates.

Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

Feature

I. Double component, low viscosity solvent-free, environmentally friendly.
II. High transparency, room temperature curing, good adhesion.
III. After curing at -60 - 200 ºC stable and flexible.
IV. Most of the substrate without primer coating has a good adhesion.
V. Excellent waterproof, anti-corrosion, moisture, electrical insulation properties.

Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

Application

WD588AB can be widely used for electronics potting, power encapsulation, mold filling and the insulation of other electronic
components, moisture proof,confidential encapsulation, etc.


Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation


Typical property

 
Type Item
WD5885A
WD5885B
color
Brown transparent liquid
Beige/white/black liquid
Viscosity(cps)
200±50
1000±200
Mixed viscosity(cps)
500±200
density(g/ cm³)
1.15±0.05
1.2±0.05
Use ratio (weight ratio)
A:B=30:100
Working temperature (ºC)
-40~120ºC
Operation time (min)
20
Curing condition
Curing at room temperature
Gel time (min)
25
Hardness after curing (Shore A)
85
Curing time
Cure at room temperature at 25ºC for 4~6 hours
60ºC heating for 60 minutes 80ºC heating for 30 minutes
Thermal Conductivity
0.55
Breakdown voltage (kv/mm)
23
Surface resistivity (Ω)
1.0×1013
Volume resistivity (Ω.cm)
>1013
Glass transition temperature (ºC)
15ºCTMA
Water absorption
After 30 days of soaking, 0.5%
Dielectric constant
at           50Hz ,23ºC                                       5.6 IEC 60250
at            1KHz,23ºC                                       4.6 VDE 0303,TI.4
at            1MHZ,23ºC                                      3.7
Coefficient of expansion
54-6
0*10
-6

Operation


Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

Caution

1,The operating environment should be ventilate and should keep away from fire. Closely sealed after use. 
2, Avoid eye contact, in case of contact, wash with plenty of water and get medical attention immediately.
3, If contact skin, wrap with clean cloth or paper, and wash it with water and soap.
4, Keep away from children.
5, Please take a trial before application to avoid usage mistake.


Storage And Shelf Life

1, Store at the tempestuous of 25°C or cool and dry place. Avoid from sunlight, high temperature or high humidity environment. 
2, Use up as soon as possible when opened. It is strictly forbidden to expose to the air for a long time after it is opened to
avoid affecting the quality of the products. The shelf life is six months in the room temperature of 25°C. 


Package

5kgs per bottle and 20kgs per set, 20kgs, 25kgs and 200kgs also available.


Storage Conditions

The product should be sealed in its original packaging container and stored in a dry and ventilated place. In an environment of 18-40ºC, the shelf life is 6 months. If the shelf life is exceeded, analysis is required to determine whether it is still valid.

Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.


Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation



Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation
Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.

Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation
Epoxy Potting Compounds Resins Epoxy Adhesive for Electronic Potting, Casting, Encapsulation

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Gold Member Since 2020

Suppliers with verified business licenses

Manufacturer/Factory, Trading Company
Registered Capital
10000 HKD
Plant Area
>2000 square meters