Dual Interface Card Embedding Machine

Feature:
The Dual interface Card Embedding machine mainly use to welding and embedding the chip into the basic card (which basic card have been finished antenna embedding and milling by other machine ), by using our machine, produce the dual interface cards only one operator, labor-saving and improve the productivity, at the same time, ensure the product quality.
The machinery automation technology instead of the traditional manual and combine with the advance laser technology to bonding the wire which ensure the lifetime and resistance to twisting and bending of combi card.

Main Function:
1. The chip dispensing the tin automatically, high-accuracy controller controls the quantity of the tin...
2. The tin milling group milling the needless tin to ensure the quality of welding, the waste will be taken away by the suction machine.
3. The chip glue welding automatically which controlled by PLC.
4. Welding platform use rotating turntable type to weld the chip and the wire, which platform have servo positioning and the mechanical structure fixing to ensure the repeating precision of rotating turntable.
5. The servo motor driving the laser welding head to finish the connection of wire and the welding point, there is a screen to show the welding position which convenient to monitor the welding effect.
6. MES chip embedding group including prewelding, hot welding, cold pressing, which for embedding the chip and the basic card.
7. The function test can test the contact and contactless at the same time, the broken cards will be got rid of and the good cards collect to the collection box.
8. Air cylinder drive the card connection system to collect the card.

Technical Parameters:
1. Overall dimensions: Approx. L12800mm*W1300mm*H1800mm
2. Weight: Approx. 1500kg
3. Power supply: AC220V, 50/60Hz
4. Power: Approx. 15KW
5. Air pressure: 6kg/cm2
6. Air consumption: About 450L/min
7. Control: Servo system+PC
8. Tolerance of adjustment: 0.01mm
9. Accuracy: Scale of servo system=0.01m
10. Applicable materials: Low temperature lead-free solder paste, 0.1mm Tin copper clad steel, Hot melt adhesive tape, standard strip chip, ISO standard basic card.
11. Operator: 1 person
12. Output rate: About 1200PCS/H
13. Product percent of pass: 99.5%