The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an accuracy of ±10 microns and an ultimate bonding force of up to 500N and an ultimate bonding efficiency of up to 10,000 pieces per hour (depending on the process). The DW9621 series adopts an open architecture and modular design, providing customers with on-demand customization capabilities for maximum efficiency. It integrates various functional modules such as dispensing, automatic tool changing, and hot-press bonding, and can handle multiple wafer sizes and substrate transfer methods to meet various packaging technologies, including power module,IGBT, SiC, MCM, SiP, etc.
- High bonding force: Achieves a bonding force of up to 500N with a self-developed force control system.
- High efficiency: Meets high-precision die bonding accuracy of ±10 microns and achieves an ultimate bonding efficiency of up to 10,000 pieces per hour (depending on the process).
- Supports sintering process: Sintering film treatment, sintering paste distribution, pre-coated sintering paste.
Bonding head heating temperature of 450ºC, substrate heating temperature of 300ºC.
- Customizable open platform: Modular design combined with standardized platform design concept, releasing a new product line every 6 months; compatible with different categories of development needs, supports multiple feeding methods, and can be customized production lines according to customer requirements.
Product model |
DW9621 |
X/Y Placement Accuracy |
±10µm @ 3σ |
Theta Placement Accuracy |
±0.15°@ 3σ |
heating temperature |
Up to 350°C (optional) |
binding force |
500 N (max) |
rotation angle |
0°- 360° rotation |
wafer size |
Wafer size: 8" - 12" (4", 6" customizable) |
chip/component size |
0.8mm - 15mm (customizable according to requirements) |
chip thickness |
0.05mm - 7mm(die attach) |
frame size |
5" - 15" (125mm - 375mm) |
feeding method |
Waffle pack/Gel-Pak®2" x×2" and 4" ×4"/JEDEC tray |
substrate type |
FR4, ceramic, flex, boat, 8"/12" wafers, other |
UPH |
Up to 10,000 pieces per hour (max) |
Equipment Dimensions |
1160mm×1225mm×1800mm |
Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.
1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.
2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.
3.What is the minimum order quantity for the product?
1 set.
4.How long does it take to ship an order?
Within 100 days of signing the contract
5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.