| PCB Item Manufacture Capacity |
| Layer Counts |
1L-40L |
|
Min Hole Size(mechanical) |
0.15mm |
| Base Material |
NY,SYL,TUC,EMC,Isola,Rogers,Arlon,Nelco,Taconic,Panasonic |
|
Min Hole Size(laser hole) |
0.1mm |
| FPC Material |
Dupont,Taiflex,SYL,Thinflex |
|
Hole Size Tol (+/-) |
PTH:+0.075mm; NPTH: +0.05mm |
| Material Thickness(mm) |
T=0.1mm-3.2mm |
|
Hole Position Tol |
±0.075mm |
| Max board size(mm) |
1250mm x570mm |
|
HASL/LF HAL |
2.5um |
| Board Outline Tolerance |
±0.10mm |
|
Immersion Gold |
Nickel 3-7um Au:1-5u" |
| Board Thickness |
0.4mm--3.2mm |
|
Surface Finish |
HASL (LF), Gold Plating,Gold Finger,immersion Silver,immersion gold, OSP |
| Thickness Tolerance |
±10% |
|
Copper Weight |
0.5--6 OZ |
| Minimum line/space |
0.05mm/0.05mm |
|
Solder mask |
Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Min Annular Ring |
0.12mm |
|
Silk screen |
White, Black, Blue,Yellow |
| Quality Criterion |
IPC-A-600J,IPC-6012E,IPC-4101C,IPC-SM-840,IPC-TM-650 UL796 |
|
Certificate |
IATF16949;2016 ISO14000 |
| |
|
|
|
|
| PCBA Item Manufacture Capacity |
| Items |
|
Capacity |
| PCB Assembly Min. IC Pitch |
|
0.20mm(8mil) |
| PCB Assembly Foot Pin |
|
SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA |
| PCB Assembly Min. Chip Placement |
|
201 |
| PCB Assembly Max. PCB Size |
|
410mm x 600mm(16.2" x 23.6") |
| PCB Assembly Maximum BGA Size |
|
74mm x 74mm(2.9" x 2.9") |
| PCB Assembly BGA Ball Pitch |
|
0.2mm/8mil |
| PCB Assembly BGA Ball Diameter |
|
0.03mm/1.2mil |
| PCB Assembly Method |
|
SMT, DIP, AI,MI |
| PCB Assembly Certification |
|
ISO14000, IATF16949 |
Audited Supplier 
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