• 8" Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802
  • 8" Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802
  • 8" Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802
  • 8" Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802
  • 8" Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802
  • 8" Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802

8" Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802

Customized: Non-Customized
Structure: Desktop
Material: Steel
Certification: CE, ISO
Application: School, Lab
Type: Lapping Machine
Customization:
Diamond Member Since 2016

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Manufacturer/Factory & Trading Company

Basic Info.

Model NO.
EQ-Unipol-802
Product Name
Lapping and Polishing Machine
Transport Package
Wooden Case
Specification
polishing machine
Trademark
CYKY
Origin
China
Production Capacity
500 Sets Per Month

Product Description

8" Precision Auto Lapping and Polishing Machine with two work stations CY- EQ-Unipol-802

Description of the auto lapping and polishing machine:
CY-EQ-UNIPOL-802 machine is equipped with 8" super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 3" in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well. Combining with flat sample holder (included), the three-hole metallographic sample holder (optional), and precision thinning fixture (optional), the Unipol 802 can lap and polish various samples automatically.

Specification of the auto lapping and polishing machine:
Power

AC 110V and 208-240V (50/60Hz) switchable for worldwide operation.

Features
  • One cast iron plate for lapping and one cast aluminum plate for polishing.
  • Two rocking workstations with wafer holders and condition rings can be controlled independently for polishing 2 pcs of 3" wafers in one running.
Super-Flat 8" Lapping Plate Flatness < 2.5 micron / inch²
Precision Rotating Shaft Running Off < 5 micron
Aluminum Case Heavy Duty Cast with Bright Painting (Color: Black)
Two Work Stations Rocking Speed 8° Rocking with adjustable speed of 0 - 20 rocking / minute
Two Flat Sample Holders 80 Dia. x 35 T mm for carrying <3" diameter wafer
Two Condition Rings 95 O.D. x 88 I.D. x 32 T mm
Master Plate Speed Range 0 ~~ 125 rpm variable with digital display
Operation Timer 0 - 99 hours
Motor 300 W high torque DC motor
Dimensions 525 L x 350 W x 325 H (mm)
Net Weight 120 lbs



Optional Parts
  • Automatic Slurry Feeder
  • 2" Polishing Fixture for Precision / Automatic Thinning and Polishing
  • Polishing Sample Holder with Three 1" Holes for Metallography
  • 8'' high purity ceramic lapping plate

Warranty
  • One year limited with lifetime support
  • Rusting and damage due to improper storage condition or maintenance are not covered by warranty
Compliance
  • CE Certified
Package Dimensions 40" x 38" x 30"
Shipping Weight 160 lb
Applications Polishing machine applications

reference picture of the lapping and polishing machine:
8&quot; Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802
8&quot; Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802

 
other related polishing machine:
8&quot; Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802
8&quot; Precision Auto Lapping and Polishing Machine with Two Work Stations Cy- EQ-Unipol-802
Contact information:
 
 

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