Guangdong Dongsen Zhichuang Technology Co., Ltd. was established in 2009 with a total registered capital of 11 million Chinese Yuan and more than 200 employees. We have two independent manufactuers located in Huizhou and Jiangxi separately . we also have oversea offices in HK and Japan to provide high-quality services to all our valued customers.
Our company has passed ISO 9001, ISO1400, IATF16949, OHSAS18001 and other related management system certifications, and our products have got UL\CE\ROHS\REACH and other certifications.
As a professional manufacturer in the field of thermal interface materials and EMI electromagnetic interference materials, Dongsen mainly provides silicone thermal conductive pads, thermal grease, thermal graphite sheet , thermal conductive tape rolls ,metal foil tapes (copper foil tape, aluminum foil tape), high temperature polyimide tapes, also we provide die cutting customize service as per customers' drawings. We are one of the biggest and most comprehensive solution suppliers of thermal conductivity materials, insulating materials and shielding materials in China.
Dongsen focuses on meeting customer needs and strives to maximize the profits of customers. We gain trust of various well-known customers, and has long-term cooperation with Samsung, ZTE, Changhong, Panasonic, Foxconn, Midea, etc., and has been well received!
Our AdvantagesHigh thermal conductivity thermal grease
Low oil yield, low volatility, high reliability, thinner thickness. It can fully
wettability transfer interface of heat, eliminate the air gap between the formation of interface, forming effectively heat
transfer path, which can quickly will transfer to the radiating heat device , and thermal conduction excellent effect .
1.High thermal conductivity, insulation and low temperature performance, high stability and good use.2.Water resistance, not curing, metal material on contact without corrosion (copper, aluminum, steel).3.Volatilization loss, low melting, not dry, not good material adaptability and large temperature range of use ( -50-250ºC ).4.Non-toxic, tasteless, no corrosion, and chemical and physical properties of stability.
2.Between a CPU and a heat spreader.
3.Used between a semiconductor and heat sink.
4.Areas where heat needs to be transferred.
5. Thermoelectric cooling device.
6. frame or other type of heat spreader.