Shenzhen, Guangdong, China
Business Type: Manufacturer/Factory
Layer | 4 |
Material | FR4-TG150 |
Board Thickness | 1.6mm |
Copper Thickness | 2oz |
Soldermask | Green |
Silkscreen | White |
Surface Finishing | ENIG |
Min Hole Size | 0.3mm |
Layer Count | 1 to 22 layer |
Material Type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers.etc. |
Board Thickness | 0.21mm to 7.0mm |
Copper Thickness | 0.5 oz to 7.0 oz |
Min. Line Width&Space | 3/3 mil |
Min. Mechnical Hole | 0.15mm(0.8mm for Alu PCB) |
Min.Solder Mask Dam | 0.075mm |
Max.Aspect Ratio | 10:1 |
PTH Size Tolerance | +/- 0.05mm |
Impedance Control Tolerance | +/- 8% |
Routing Tolerance | +/- 0.1mm |
Electric Strength | >103KV/mm |
Current Breakdown | 10A |
Solder Mask Abrasion | >6H |
Solder Mask Color | Green/Black/White/Red/ Blue/Matt Blue/Matt Black |
Silkscreen Color | Yellow/Black/White/ Orange/Grey |
Surface Finishing | HASL / HASL lead free,OSP, Tin Plating, Silver Plating Immersion Silver/Tin, ENIG, Hard Gold plating |
PCB Packing | - Inner Packing: Vacuum packing / plastic bag - Outer packing: Standard carton packing |
1-2L | 4L | 6L | 8L | 10L | |
Sample | 3-4 | 5 | 6 | 7 | 8 |
Mass Production | 6-8 | 10 | 12 | 14 | 16 |