| After-sales Service: | Provide |
|---|---|
| Condition: | New |
| Certification: | ISO |
| Warranty: | 12 Months |
| Automatic Grade: | Automatic |
| Installation: | Vertical |
| Customization: |
|---|
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Advantages of HMDS pretreatment system:Overall machine size and vacuum chamber size:
1. Inner tank size: 450*450*450mm; 300*300*300mm; 610*610*650mm (W*D*H)
2. Vacuum degree: 150Pa; using vacuum pump
3. Heating method: heating around the outside of the cavity
4. Temperature: RT+10ºC~200ºC; microcomputer temperature controller, precise and reliable temperature control.
5. Temperature control accuracy: ±2%ºC (within 200ºC);
6. Can hold about 100 2-inch LED chips;
7. The unboxing temperature can be set by the user to reduce the process time (normal process is between 50 minutes and 90 minutes)
(The baking time depends on the needs of the product), which is the normal working cycle and does not include the cooling time (because the cooling time is conventional cooling));
8. The entire system is made of high-quality materials, no dust-generating materials, and is suitable for Class 100 photolithography room purification environment. Door closed loosely
The tightness can be adjusted and the integrally formed silicone rubber door seal ensures high vacuum in the box. The studio is made of stainless steel plates.
Electrolytic polishing ensures product durability.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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