| Type: | Rigid Circuit Board |
|---|---|
| Flame Retardant Properties: | V0 |
| Dielectric: | Aluminium |
| Base Material: | Aluminum |
| Insulation Materials: | Organic Resin |
| Mechanical Rigid: | Rigid |
| Customization: |
|---|
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Audited Supplier | Test item | Technology request | Unit | Test result | ||||
| 1 | Peel Strength | A | ≥ 1.0 | N/mm | 1.05 | ||
| After thermal stress (260 ordm;C ) | ≥ 1.0 | N/mm | 1.05 | ||||
| 2 | Blister test AfterThermal stress (288 ordm;C, 2min) | 288ordm;C 2 min No delaminating |
/ | OK | |||
| 3 | Themal Resistance | ≤ 2.0 | ordm;C /W | 0.65 | |||
| 4 | Flammability(A) | FV-O | / | FV-O | |||
| 5 | Surface Resistivity | A | ≥ 1 × 10 5 | M Ω | 5.0 × 10 7 | ||
| Constant humidity treatment (90%,3 5 ordm;C ,96h) |
≥ 1 × 10 5 | M Ω | 4.5 × 10 6 | ||||
| 6 7 |
Volume Resistivity | A | ≥ 1 × 10 6 | M Ω@ m | 1.0 × 10 8 | ||
| Constant humidity treatment (90%,3 5 ordm;C ,96h) |
≥ 1 × 10 6 | M Ω@ m | 1.9 × 10 7 | ||||
| 8 | Dielectric Breakdown (DC ) | ≥ 25 | Kv/mm | 31 | |||
| 9 | Dielectric constant (1MHz) (40 ordm;C, 93% , 96h) |
≤ 4.4 | / | 4.2 | |||
| 10 | Dielectric dissipation factor (1MHz ) (40ordm;C ,93%,96h) |
≤ 0.03 | / | 0.029 | |||
| Accelerated aging experiment (125 ordm;C ,2000h) |
The laminate bace should no wrinkles,no crack,no delaminating or no pine | / | OK | ||||
| 11 | High low temperature impact test (-50 ordm;C, 15min, 80ordm;C , 15minTOTAL DO 15 ~ 20 Circulation) |
Peel Strength | / | N/mm | 1.39 ~ 1.64 | ||
| Surface Resistivity | / | M Ω | 1.9 × 10 8 ~6.4 × 10 8 | ||||
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