| Type: | Rigid Circuit Board |
|---|---|
| Flame Retardant Properties: | V0 |
| Base Material: | Aluminum |
| Mechanical Rigid: | Rigid |
| Board Thickness: | 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm |
| Thermal Conductivity: | 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K |
| Customization: |
|---|
Suppliers with verified business licenses
Audited Supplier | Capabilities | ||
| Number of Layers | From 4-layer to 22- Layer | |
| Material | FR-4,HighTg, Rogers Halogen Free |
|
| PCB Thickness | Min.thickness | 0.4mm(16mil) |
| Max.thickness | 3.2mm(128mil) | |
Surface finished |
Gold Plating | |
| Immersion Gold(Silver) | ||
| HAL Lead Free | ||
| Hot Air Solder Leveling(HASL) | ||
| Entek Coating (OSP) | ||
| Solder Mask | Green,White,Black,Yellow,Red,Blue | |
| Other printing | Gold Finger | |
| Carbon Print, Peelable Mask | ||
| Solder Mask Plugged Hole | ||
| Copper thickness | 1/ 2 oz (18 μm) - 4 oz (140 μm) | |
| Min. Finished Hole Size | 0.2mm(8mil) | |
| Hole Size Tolerance (PTH) | +/ -0.076mm (3 mil) | |
| Hole Size Tolerance (NPTH) | +/-0.05mm (2 mil) | |
| Min. Line Width and Spacing | 0.1mm (4 mil) | |
| Min. Solder Mask Clearance | 0.05mm (2 mil) | |
| Min. Annular Ring | 0.076mm (3mil) | |
| Profile and V-Cut | CNC-Routing, Stamping and Beveling,V-CUT,CNC | |
| Special Process | Micro-section, Chamfer for Gold Finger | |
| File format | Gerber file , CAM350 ,Protel,PowerPCB | |
| E-TEST | Flying Prob , E-test ,Fixture | |
| Other Test | Impedance , Slice up | |
| Warp & Twist | ≤0.7% | |
Suppliers with verified business licenses
Audited Supplier 
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