| Application: | Structure Ceramic, Industrial Ceramic |
|---|---|
| Type: | Ceramic Plates |
| Finished Product: | Ceramic Substrate PCB |
| Substrate Material: | 96%, 99.6% Alumina |
| Feature: | Strong Bonding Strength Between Ceramic and Metal |
| Usage: | to Realize Electrical Connections |
| Customization: |
|---|
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Audited Supplier The metallized ceramic substrate is a ceramic plate obtained by metallizing the surface of the ceramic substrate by technical means. The ceramic
substrate has better electrical function, thermal conductivity and insulation after metallization.
The silver firing method is to infiltrate a layer of metallic silver on the surface of the ceramic substrate. Silver has strong electrical conductivity and
good oxidation resistance. The fired silver layer is firmly bonded, the thermal expansion coefficient is close to that of the bare ceramic substrate,
and the thermal stability is good. In addition, the firing temperature is low, and the requirements on the atmosphere are not strict, and the firing
process is simple and easy.
The following is a schematic diagram of the Silver Firing Method of the ceramic substrate surface metallization process.
In order to ensure the best performance of our ceramic circuit boards, All products have to pass strict inspection before they go out.
Jinghui provides customized production of high-precision ceramic circuit boards for enterprises. The products cover communication, power supply,
medical equipment, industrial control, automotive electronics, intelligent equipment, transportation rails, unmanned aerial vehicles, security
electronics, high-power LED lighting and other fields.
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