Higher heat resistance 6051 insulation polyimide film
6051 polyimide film is synthesized by polymerizing PMDA and ODA in strong polar solvents through the process of forming film and imines treatment at high temperature.
Features and Applications:
class H insulation
Excellent physical, chemical and electrical properties
Atomic radiation resistant, solvent resistant
low & high temperature resistant (as low as -452F(-269°C) and as high as +500F(+260°C).
Our Services
Technology Data of 6051 polyimide film
NO |
Index Description |
unit |
index value |
1 |
Density |
g/cm3 |
1.38~1.43 |
2 |
Contraction rate,longitudinal and horizontal 150°c-400°c |
% |
<1.0
<3.0 |
3 |
Surface resistively,200°c |
Ω |
>1.0*1013 |
4 |
volume resistively,200°c |
Ω.m |
>1.0*1010 |
5 |
Relative Dielectric factor constant 48-62HZ |
- |
3.5±0.4 |
6 |
Media Loss Factor 48-60HZ |
- |
<4.0*10-3 |
7 |
Long-term Thermal Resistant |
- |
<4.0*10-3 |
8 |
Temprature Index |
- |
>180 |
Polyimide film Application:
Used in flexible prinyed circuits and as insulating materials of flat electric cables, electromagnetic wires and motors.
Available: In rolls