• High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)
  • High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)
  • High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)
  • High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)
  • High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)
  • High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)

High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)

Type: Polymer Ceramic Copper
Dielectric: Polymer Ceramic Copper
Material: Copper
Application: Communication
Flame Retardant Properties: HB
Mechanical Rigid: Fexible
Samples:
US$ 10/pcs 1 pcs(Min.Order)
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Customization:
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Basic Info.

Model NO.
WL-CT300
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Brand
Wl
Pimd
Less Than -158dbc
Sample
Available
Dielectric Thickness
1.034mm
Density(G/ Cm3)
1.57
Dielectric Constant
3.0±0.05
Type of Copper Foil
RTF Copper Foil
Transport Package
Standard Export Package
Trademark
WL
Origin
China
Production Capacity
50000PCS/Month

Product Description

High quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)

Model: WL-CT300

 

Introduction:

WL-CT300 is laminated by hydrocarbon polymer and cermaic with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. It is a kind of thermoset laminates, and the performance is consistent with foreigh similar products.

 

Highlight:

1. The hydrocarbon polymer ceramic woven fiberglass is a thermosetting resin system, which has a better hardness than PTFE thermoplastic resin system, has a good loss value.

2. Excellent PIM performance

3. Dk, DF value is stable, DK/DF changes little with increase of frequency.

4. Good electrical performance, excellent thermal conductivity and be better insulation and heat treatment capability than PTFE materials.

5. It can be compatible with the process of FR-4, no need for plasma process. The process is relatively simple, compatible with most PP films.Besides, PCB process is good, especially suitable for the manufacturing of multilayer PCB.

6. Low thermal expansion co-efficient improves the reliablility of the plating through hole and dimensional stability.

7. Especially suitable for lead-free soldering process.
 

Specifications:

 

Types

Double side

Dimensions (mm)

460X610(18''X24''), 915X1220(36''X48'')

For special dimension, customized laminates is available.

Dielectric constant

3.00±0.05

Thickness and Tolerance(mm)

1.034±0.076

Dielectric thickness can be customized.

Thickness of RTF copper foil

RTF: 0.5OZ or 1OZ
Dissipation Factor (DF) @10GHZ     unit: tgδ   0.0031

 Copper peel strength(1oz copper) 

7.2N/cm

Surface Resistivity (M·Ω)

Condition: Normal state (500V DC): ≥ 2×108

Volume Resistivity(MΩ.cm) 

Condition: Normal state ≥ 3×108

Tg(ºC)

Test condition:TMA; >280ºC

Td(ºC)

Test condition: TGA,421

CTE(typical) 

Condition: -55ºC to 288ºC (X Axis: 15; Y Axis: 14; Z Axis: 31)
   

 

Our Factory:
High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)  

High Quality Hydrocarbon Polymer Ceramic Copper Clad Laminates (WL-CT300)
 
 
 


 

 

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