Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses:
Widely used in LED sapphire substrate, optical glass wafers, quartz wafers, molds, compressor valves, hydraulic seals, light guide plate, light post joint and other materials of single-side grinding, polishing.
Products Show
Working principle:
1. The grinding machine is a precision grinding and polishing equipment, the grinding and polishing materials are placed on the grinding disc, the grinding disc rotates against the clock, the correction wheel drives the workpiece to rotate, the gravity pressure on the workpiece, the workpiece and the grinding disc for relative running friction, to achieve the purpose of grinding and polishing.
2. The dressing mechanism of the grinding disc adopts the hydraulic suspension guide rail to move back and forth, and the diamond trimming knife trims the grinding surface of the grinding disc precisely to obtain the ideal plane effect.
Special points:
1. Usually, the traditional way of polishing plate is to use electroplate wheel to trim, which is not ideal. The error will be tens of microns or even hundreds of microns, through the dressing machine, grinding disc flatness can reach ±0.002mm. The flatness of the workpiece after processing can reach ±0.0005mm (φ50mm).
2. A series of grinding machine parts are pressurized by pressing the weight block.
APPLICATION
Process |
Industry by Substance |
Industry by Applicability |
Double Plate Lapping & Polishing |
Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone |
Sealing |
valve and sealing ring(liquid, oil, gas) |
Semiconductor |
LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) |
Plastic |
PE, E/VAC, SBS, SBR, NBR, SR, BR, PR |
Optics(flat) |
optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass |
Gemstone |
jade, sapphire, agate, etc. |
Others |
graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. |
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed. |
SPECIFICATION
Standard Specification |
Machine Model |
FD6B |
FD9B |
FD13-6B |
Lower Plate Diameter |
Φ386 mm / 15 inches |
Φ640 mm / 25 inches |
Φ973 mm / 38 inches |
Upper Plate Diameter |
Φ386 mm / 15 inches |
Φ640 mm / 25 inches |
Φ973 mm / 38 inches |
Star Wheel Parameter |
DP 12, Z=66, A=20° |
DP 12, Z=108, A=20° |
DP 19.3, Z=152, A=20° |
Conditioning Ring Parameter |
DP 12, Z=66, A=20° |
DP 12, Z=108, A=20° |
DP 19.3, Z=152, A=20° |
Max. Workpiece Diameter |
Φ120 mm |
Φ180 mm |
Φ290 mm |
Process Thickness |
0.2mm≤N≤20mm |
0.2mm≤N≤25mm |
0.2mm≤N≤30mm |
Number of Station |
3≤N≤5 |
3≤N≤5 |
3≤N≤5 |
Plate Rotate Speed |
0-60 rpm |
0-60 rpm |
0-50 rpm |
Total Weight |
600 kg |
2000 kg |
3200 kg |
Total Floor Space |
700×950 mm |
1350x960 mm |
1700×1380 mm |
Built-In Optional Kits |
Grade |
Standard |
Advanced |
Slurry Supply System |
- |
Integrated with PLC |
Facing and Grooving System |
- |
Integrated with PLC |
Machine Enclosure |
- |
Framed by Metal Plate |
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
SAMPLE DEMONSTRATION (DOUBLE PLATE)
About the Company
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.